High Layer Count FR4 PCB Production Record #FR4-20260330-021

For this production record, we manufactured 100 panels of 10-layer FR4 PCBs featuring a custom stackup, impedance control, and 4/4 mil trace width and spacing. The panels measure 170 x 110 mm with 1.6 mm thickness and 1 oz copper weight, incorporating a 0.2 mm minimum hole size. During fabrication, we completed detailed stackup impedance engineering, applied trace width compensation during inner layer imaging and etching, then executed precise layer stack alignment and high-pressure lamination to maintain registration across the multilayer construction.

Matte black soldermask with white silkscreen and immersion gold ENIG surface finish were applied after solder mask processing. We performed electroless nickel deposition and immersion gold deposition, followed by TDR impedance testing on the impedance controlled PCB to verify the custom stackup parameters. All 100 panels then completed electrical testing with no rework required, confirming uniform electrical and physical properties throughout the batch.

The full sequence from material preparation through final testing took 24.4 days and delivered panels that met every specified tolerance for this tighter-geometry multilayer design. This execution reflects consistent process control for impedance controlled PCBs that require both fine features and reliable signal integrity.