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ENIG FR4 PCB Production Record #FR4-20260401-055

FR4 PCB 12 Layers ENIG (Immersion Gold) Mass Production
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 1000 pcs
Layers 12 Layers Board Type Single PCB
Dimensions 58 x 24.9 mm Copper Weight 1oz
Thickness 3 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 13 17:48
Files Ready
Mar 13 17:57
Engineering Review Completed
Mar 13 19:47
Payment down
Mar 16 17:26
Production Started
Mar 16 17:27
Production Completed
Mar 31 14:48
Progress: 0/6
Engineering Review time: 1h
Production time: 14.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.2d
Carrier
UPS
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Apr 01 18:47

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This order comprised 1000 units of 12-layer FR4 PCBs featuring a 3 mm board thickness and a custom stackup. With dimensions of 58 x 24.9 mm, 1 oz copper throughout, and standard 6/6 mil track spacing, the design required careful layer registration during the build. The thick construction demanded controlled resin flow and cooling rates in high-pressure lamination to maintain flatness and prevent any delamination or warp across the multilayer stack.

 

We executed the full process sequence including inner layer imaging, circuit etching, solder mask application, electroless nickel deposition, and immersion gold ENIG finish. The green soldermask combined with white silkscreen delivered clear readability while the ENIG surface provided uniform pad planarity and oxidation resistance. Each board then advanced through batch AOI inspection and full electrical testing to confirm net continuity and isolation.

 

The completed run showed consistent thickness tolerance and mechanical stability, with all 1000 boards meeting the specified requirements. Production was completed in 14.9 days, delivering reliable multilayer performance without deviation from the custom stackup parameters.

 

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260529-059 FR4 PCB 2 147.3 x 53.8 Green ENIG (Immersion Gold) 5 View detail
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail

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