ENIG FR4 PCB Production Record #FR4-20260401-055

This order comprised 1000 units of 12-layer FR4 PCBs featuring a 3 mm board thickness and a custom stackup. With dimensions of 58 x 24.9 mm, 1 oz copper throughout, and standard 6/6 mil track spacing, the design required careful layer registration during the build. The thick construction demanded controlled resin flow and cooling rates in high-pressure lamination to maintain flatness and prevent any delamination or warp across the multilayer stack.

We executed the full process sequence including inner layer imaging, circuit etching, solder mask application, electroless nickel deposition, and immersion gold ENIG finish. The green soldermask combined with white silkscreen delivered clear readability while the ENIG surface provided uniform pad planarity and oxidation resistance. Each board then advanced through batch AOI inspection and full electrical testing to confirm net continuity and isolation.

The completed run showed consistent thickness tolerance and mechanical stability, with all 1000 boards meeting the specified requirements. Production was completed in 14.9 days, delivering reliable multilayer performance without deviation from the custom stackup parameters.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→