4 Layer FR4 PCB Production Record #FR4-20260409-002
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 20 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 29.46 x 30.23 mm | Copper Weight | 1oz |
| Thickness | 0.4 mm | Min Track / Spacing | 3/3mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This compact 4-layer FR-4 board measured 29.46 × 30.23 mm with 1 oz copper on inner and outer layers and a thin 0.4 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 20 pieces as 2×2 panels with 4 mm process edges, the design included 3 mil line/space geometry, 0.15 mm holes, blind vias, ENIG surface finish, and resin plugging capability. Mechanical forming and 100% flying probe testing were specified for this small-form-factor run.
DFM analysis confirmed the stackup for the 0.4 mm target thickness and incorporated serial numbering from PN1 to PN20 with flexible positioning. BGA areas presented tight 3.94 mil original pitch that reduced to 2.94 mil after compensation, eliminating viable solder mask bridges and increasing bridging risk during soldering. Pad windowing inconsistencies with stencil layers and PDF thickness references were reconciled. Laser QR code marking costs were noted against marking requirements. Production files received final confirmation after these adjustments. tight pitch BGA mask handling ensured optimized openings to balance solderability and short prevention.
The order advanced to completion with all parameters verified within tolerance. The thin multilayer construction and fine features maintained good registration and surface quality, providing consistent boards ready for assembly.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260605-042 | FR4 PCB | 4 | 65 x 100 | Green | HASL Lead Free | 5 | View detail |
| FR4-20260605-041 | FR4 PCB | 4 | 66.04 x 54.1 | Green | HASL Lead Free | 5 | View detail |
