6 Layer FR4 PCB Production Record #FR4-20260414-039
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 107.25 x 16 mm | Copper Weight | 1oz |
| Thickness | 0.8 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This 6-layer FR-4 board measured 107.25 × 16 mm with a thin 0.8 mm thickness, TG150 material, and 1 oz copper on both sides. Produced as 10 pieces in 1×2 panels for 5 sets, the order used ENIG surface finish (1 µin gold), green solder mask, and white silkscreen. Minimum holes were 0.2 mm with a tight 5 mil line/space geometry. Process edges of 4 mm on all sides supported routing separation with stamp holes. The 13-day schedule included 100% flying probe testing.
DFM review resolved edge, panel, and mask details. Copper along the board outline was too close and risked exposed copper after routing; copper was shaved 8 mil from the center of the outline except in plating-edge regions. Single Mark points outside the array were disregarded. The panel followed the customer 1×2 configuration with routing slots and mouse bites; tooling holes and Mark points were added on the process edges. The GM4 layer was identified as an assembly designator layer and ignored for fabrication. Stackup was confirmed to deliver 1 oz finished copper on all layers and a finished thickness of 0.89 ± 0.1 mm. Multiple IC and pad areas carried solder-mask openings; these were processed according to the original design without forcing bridges.
Confirmed copper setback, panel construction, stackup targets, and mask-window decisions were implemented prior to production. The narrow multilayer boards achieved consistent ENIG plating and dimensional control within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.
Discover how AIVON manufactures 6 Layer FR4 PCBs, including multilayer stackup optimization, impedance control requirements, fabrication processes, manufacturing challenges, and real production experience from customer orders.
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260608-023 | FR4 PCB | 6 | 239 x 355 | Black | HASL Lead Free | 25 | View detail |
