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4 Layer FR4 PCB Production Record #FR4-20260420-025

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 158.4 x 87.8 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Apr 13 20:33
Files Ready
Apr 13 20:33
Engineering Review Completed
Apr 13 20:35
Payment down
Apr 14 00:20
Production Started
Apr 14 00:25
Production Completed
Apr 19 03:31
Progress: 0/6
Engineering Review time: 2 min
Production time: 5.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
FedEx IP
Destination
FRANCE
Shipping Method
Express Air
Shipping Time
Apr 20 03:35

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 PCB was produced in a quantity of 40 pieces at 1.0 mm finished thickness using TG150 material with 1 oz copper on all layers. Board dimensions measured 158.4 × 87.8 mm in a 4×2 panel arrangement, featuring 5 mil minimum line width and spacing, ENIG surface finish, green solder mask, and white silkscreen. Mechanical routing combined with V-scoring was applied, and 100% flying probe testing verified electrical continuity within the 3-day lead time.

 

Several DFM items required clarification before production release. Trace-to-outline clearances fell short of standard requirements (routing edge ≥0.2 mm, V-cut edge ≥0.4 mm), prompting a 0.1 mm outward shift of the V-cut and outline that was confirmed acceptable after dimensional comparison. Multiple silkscreen characters overlaid pads and were adjusted by removing text from pad areas to prevent soldering defects. IC pad open-window connections were retained per original design, model marking placement across solder mask and silkscreen layers was verified, and indicated positions were confirmed as MARK points corresponding to 1.5 mm holes.

 

Edge clearance and silkscreen adjustments were implemented after customer confirmation, ensuring reliable depanelization and clean solderability. Production maintained consistent registration and surface finish quality across the batch. Detailed records of the edge clearance and V-cut adjustment method applied to this order provide further reference for similar tight-geometry multilayer boards.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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