| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 100 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 147.6 x 252 mm | Copper Weight | 3oz |
| Thickness | 1.6 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Custom | Impedance Control | No |
This 6-layer FR-4 board measured 147.6 × 252 mm with 1.6 mm thickness, TG170 material, and heavy 3 oz copper on both sides. Produced as 300 pieces in 1×3 panels for 100 sets, the order used ENIG surface finish with approximately 72 % gold coverage, green solder mask, and no silkscreen. Minimum holes were 0.3 mm with standard 10 mil line/space and high hole density. Resin plugged vias were specified, and the 13-day schedule included 100% flying probe testing together with mechanical routing.
DFM review addressed process-edge, via, and stackup details. As a heavy-copper design the process edges lacked fiducials and locating holes, and the board perimeter had no copper pour; these conditions were confirmed. Resin plugging was limited to the 0.3 mm vias only. Material availability required a minor stackup adjustment according to the attached drawing. Areas of insufficient clearance were resolved by trimming pads to restore minimum spacing. Two locations showed material inconsistency, and the originally confirmed special-material stackup carried a procurement lead time exceeding one month, prompting a request to revise the stackup for practical production.
Confirmed via plugging scope, pad trimming, and stackup revision were implemented prior to production. The heavy-copper boards achieved consistent ENIG plating and reliable resin filling across the 6-layer construction. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.
Discover how AIVON manufactures 6 Layer FR4 PCBs, including multilayer stackup optimization, impedance control requirements, fabrication processes, manufacturing challenges, and real production experience from customer orders.
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260611-021 | FR4 PCB | 2 | 245.59 x 304.79 | White | HASL Lead Free | 1400 | View detail |