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6 Layer FR4 PCB Production Record #FR4-20260426-036

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 100 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 147.6 x 252 mm Copper Weight 3oz
Thickness 1.6 mm Min Track / Spacing 10/10mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 17 15:38
Files Ready
Mar 17 15:38
Engineering Review Completed
Mar 17 15:57
Payment down
Mar 23 18:29
Production Started
Apr 07 15:23
Production Completed
Apr 26 15:26
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 19.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 7 min
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Apr 26 15:32

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Electrical Testing

Manufacturing Summary

This 6-layer FR-4 board measured 147.6 × 252 mm with 1.6 mm thickness, TG170 material, and heavy 3 oz copper on both sides. Produced as 300 pieces in 1×3 panels for 100 sets, the order used ENIG surface finish with approximately 72 % gold coverage, green solder mask, and no silkscreen. Minimum holes were 0.3 mm with standard 10 mil line/space and high hole density. Resin plugged vias were specified, and the 13-day schedule included 100% flying probe testing together with mechanical routing.

 

DFM review addressed process-edge, via, and stackup details. As a heavy-copper design the process edges lacked fiducials and locating holes, and the board perimeter had no copper pour; these conditions were confirmed. Resin plugging was limited to the 0.3 mm vias only. Material availability required a minor stackup adjustment according to the attached drawing. Areas of insufficient clearance were resolved by trimming pads to restore minimum spacing. Two locations showed material inconsistency, and the originally confirmed special-material stackup carried a procurement lead time exceeding one month, prompting a request to revise the stackup for practical production.

 

Confirmed via plugging scope, pad trimming, and stackup revision were implemented prior to production. The heavy-copper boards achieved consistent ENIG plating and reliable resin filling across the 6-layer construction. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260611-021 FR4 PCB 2 245.59 x 304.79 White HASL Lead Free 1400 View detail

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