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2 Layer FR4 PCB Production Record #FR4-20260429-023

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 520 x 242 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL with Lead Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Apr 18 01:46
Files Ready
Apr 18 01:46
Engineering Review Completed
Apr 23 11:20
Payment down
Apr 23 11:20
Production Started
Apr 23 11:22
Production Completed
Apr 29 02:50
Progress: 0/6
Engineering Review time: 5.4d
Production time: 5.7d With Engineering Questions

Logistics Information

Production Completed→Shipping : 5 min
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Apr 29 02:54

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Molten Solder Coating
06
Hot Air Leveling
07
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board measured 520 × 242 mm with 1.6 mm thickness, TG150 material, and 1 oz copper on both sides. Produced as 60 pieces in 1×3 panels for 20 sets, the order used leaded HASL surface finish, green solder mask, and white silkscreen. Minimum holes were 0.3 mm with standard 6 mil line/space. V-cut separation was applied without process edges, and the 2-day schedule included 100% flying probe testing on the large-format panels.

 

DFM review addressed panel integrity and mask consistency. English notes in the data were disregarded. A baffle region in the lower-left area lacked sufficient connection strength; a standard set of mouse bites was recommended to prevent breakage during handling. Only one solder-mask layer was supplied, so the same openings were applied to both top and bottom sides. Openings that were larger than the holes yet smaller than the pads were removed, and the corresponding holes were processed as tented vias. Small intermediate connection tabs contained no holes, raising the question of customer self-depanelization. Two drill locations showed copper on the bottom side only, with no top-side copper and no solder-mask openings, requiring confirmation of plated versus non-plated status.

 

Confirmed stamp-hole additions, mask-layer application, and hole-attribute decisions were implemented prior to production. The large boards achieved consistent HASL thickness consistency within the accelerated timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260731-032 FR4 PCB 2 100 x 120 Black HASL Lead Free 5 View detail
FR4-20260730-005 FR4 PCB 2 168 x 107 Green HASL with Lead 5 View detail
FR4-20260727-018 FR4 PCB 2 44.8 x 57 Matte Black HASL Lead Free 20 View detail

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