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6 Layer FR4 PCB Production Record #FR4-20260506-038

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 15 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 55 x 41.7 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control Yes
Blind/Buried Vias No

Manufacturing Timeline

Order Created
Mar 28 12:24
Files Ready
Engineering Review Completed
Mar 28 13:17
Payment down
Mar 28 20:28
Production Started
Mar 28 21:23
Production Completed
May 06 11:26
Progress: 0/6
Engineering Review time: 0.9 h
Production time: 38.6d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2 min
Carrier
FedEx IP
Destination
SPAIN
Shipping Method
Express Air
Shipping Time
May 06 11:27

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

For this order, we fabricated a 6-layer impedance controlled PCB using FR4 material in panel configuration. The boards measured 55 x 41.7 mm with a finished thickness of 1.6 mm and 1 oz copper weight. Featuring a minimum trace width and spacing of 6 mil along with 0.3 mm holes, the design required precise impedance control. Engineering review and stackup impedance engineering were performed to establish the correct layer configuration and dielectric thicknesses.

 

During inner layer processing, trace width compensation was applied to achieve the target impedance values after lamination. High pressure lamination bonded the layers with accurate alignment, followed by solder mask application in green, white silkscreen printing, electroless nickel deposition, and immersion gold deposition to create a durable immersion gold ENIG surface finish.

 

Subsequent TDR impedance testing confirmed compliance with the specified requirements, and electrical testing verified circuit integrity across all 15 panels. This execution resulted in reliable boards delivered with consistent quality and performance.

 

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260608-023 FR4 PCB 6 239 x 355 Black HASL Lead Free 25 View detail

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