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4 Layer FR4 PCB Production Record #FR4-20260515-021

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 350 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 45.4 x 254 mm Copper Weight 3oz
Thickness 1.6 mm Min Track / Spacing 10/10mil
Surface Finish ENEPIG Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Apr 15 22:04
Files Ready
Apr 15 22:04
Engineering Review Completed
Apr 15 22:14
Payment down
Apr 20 16:16
Production Started
Apr 20 17:53
Production Completed
May 06 14:26
Progress: 0/6
Engineering Review time: 10 min
Production time: 15.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 8.8d
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
May 15 09:31

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 45.4 × 254 mm with 1.6 mm thickness, TG170 material, and heavy 3 oz copper on both sides. Produced as 350 pieces in 2×1 panels for 175 sets, the order used ENEPIG surface finish (2 µin gold), green solder mask, and white silkscreen. Minimum holes were 0.2 mm with standard 10 mil line/space. Four-millimeter process edges and routing separation were applied, and the 16-day schedule included 100% flying probe testing plus plating-thickness and thermal-stress reports.

 

DFM review resolved marking, hole, and panel details. A character element lay outside the board outline and required confirmation. Production numbering and serial numbers were added using the factory code and sequential identifiers at the indicated location. Press-fit holes lacked detailed specifications; the original 1.45 mm diameters were retained under standard process control. Non-plated holes of 12.5 mm exceeded practical drill capability and were converted to routed openings with a proposed tolerance of ±0.13 mm. Highlighted characters overlapped the logo and needed verification. The panel was configured as 1×2 with 4 mm process edges, 2 mm routing clearance, and bridge-plus-stamp-hole depanelization at the designated bridge points.

 

Confirmed marking placement, large-hole conversion, and panel construction were implemented prior to production. The heavy-copper boards achieved consistent ENEPIG plating and mechanical integrity within the planned timeline. Full electrical test reports, quality certificates, and the additional plating and thermal-stress documentation accompanied the shipment, confirming the panels met the specified requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260614-001 FR4 PCB 4 30.28 x 56.4 Green HASL Lead Free 15 View detail

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