4 Layer FR4 PCB Production Record #FR4-20260515-021

This 4-layer FR-4 board measured 45.4 × 254 mm with 1.6 mm thickness, TG170 material, and heavy 3 oz copper on both sides. Produced as 350 pieces in 2×1 panels for 175 sets, the order used ENEPIG surface finish (2 µin gold), green solder mask, and white silkscreen. Minimum holes were 0.2 mm with standard 10 mil line/space. Four-millimeter process edges and routing separation were applied, and the 16-day schedule included 100% flying probe testing plus plating-thickness and thermal-stress reports.

DFM review resolved marking, hole, and panel details. A character element lay outside the board outline and required confirmation. Production numbering and serial numbers were added using the factory code and sequential identifiers at the indicated location. Press-fit holes lacked detailed specifications; the original 1.45 mm diameters were retained under standard process control. Non-plated holes of 12.5 mm exceeded practical drill capability and were converted to routed openings with a proposed tolerance of ±0.13 mm. Highlighted characters overlapped the logo and needed verification. The panel was configured as 1×2 with 4 mm process edges, 2 mm routing clearance, and bridge-plus-stamp-hole depanelization at the designated bridge points.

Confirmed marking placement, large-hole conversion, and panel construction were implemented prior to production. The heavy-copper boards achieved consistent ENEPIG plating and mechanical integrity within the planned timeline. Full electrical test reports, quality certificates, and the additional plating and thermal-stress documentation accompanied the shipment, confirming the panels met the specified requirements.