PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 100 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 207.5 x 271 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
Production of the 100 panels of 8-layer boards with impedance control presented a combination of standard geometry and specific performance demands. The panels, sized at 207.5 by 271 millimeters and built to 1.6 mm thickness using 1 oz copper, incorporated a custom stackup without blind vias. With minimum trace and spacing at 6 mil and hole size of 0.2 mm, trace width compensation was performed during the imaging and etching stages to maintain design accuracy after lamination.
Following precise layer stack alignment and high pressure lamination, solder mask application and ENIG surface finish were executed through electroless nickel deposition and immersion gold. The green soldermask paired with white silkscreen completed the visual requirements. Rigorous TDR impedance testing and electrical testing verified that each panel met the impedance criteria and electrical performance standards.
The process sequence was completed over 9.1 days, yielding panels with consistent quality suitable for the intended electronic assembly.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260819-043 | FR4 PCB | 10 | 157 x 140 | Blue | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260818-014 | FR4 PCB | 2 | 110.32 x 173.3 | Green | ENIG (Immersion Gold) | 200 | View detail |
| FR4-20260811-033 | FR4 PCB | 8 | 226.8 x 109 | Green | ENIG (Immersion Gold) | 50 | View detail |
