High Layer Count FR4 PCB Production Record #FR4-20260715-027

This production record covers five units of a 10-layer impedance controlled PCB built on FR4 material in panel format. The boards measure 95 x 62.37 mm with a finished thickness of 1.6 mm and 1 oz copper throughout the custom stackup. Key challenges included the tight 3/3 mil trace and spacing geometry combined with a 0.15 mm minimum hole size, requiring precise process controls during inner layer imaging, etching, and high pressure lamination.

Green soldermask with white silkscreen was applied before the immersion gold ENIG surface finish was deposited. TDR impedance testing confirmed that all controlled lines met target values, while comprehensive electrical testing verified continuity and isolation across each panel. Layer stack alignment received close attention given the multilayer complexity and panel configuration.

The manufacturing sequence concluded in 13.2 days, producing boards that exhibited consistent quality and fully satisfied every specified parameter of this advanced 10-layer design.