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High Layer Count FR4 PCB Production Record #FR4-20260721-018

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 10 Layers Board Type Panel PCB
Dimensions 95 x 62.37 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Mar 24 23:07
Files Ready
Mar 24 23:07
Engineering Review Completed
Mar 25 00:44
Payment down
May 06 06:08
Production Started
May 13 11:10
Production Completed
May 26 17:11
Progress: 0/6
Engineering Review time: 0.6 h Multiple File Revisions
Production time: 13.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.7d
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
May 27 08:04

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This order consisted of five panelized 10-layer FR4 boards, each 95 x 62.37 mm with 1.6 mm thickness and 1 oz copper weight. The design incorporated a custom stackup, 3/3 mil trace and spacing, 0.15 mm minimum hole size, and impedance control. Engineering review focused on stackup impedance modeling and trace compensation to meet the specified electrical parameters before proceeding to material preparation and inner layer processing.

 

Layer stack alignment and high pressure lamination formed the 10-layer structure, after which green soldermask, white silkscreen, and immersion gold ENIG surface finish were applied. The ENIG process included electroless nickel deposition and immersion gold steps to provide a flat, reliable contact surface suitable for the fine features.

 

TDR impedance testing validated the controlled impedance lines, while comprehensive electrical testing confirmed circuit integrity. The executed processes delivered panels that matched the tight tolerances of this impedance controlled PCB configuration, supporting dependable performance in the intended application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260819-043 FR4 PCB 10 157 x 140 Blue ENIG (Immersion Gold) 100 View detail
FR4-20260818-014 FR4 PCB 2 110.32 x 173.3 Green ENIG (Immersion Gold) 200 View detail
FR4-20260811-033 FR4 PCB 8 226.8 x 109 Green ENIG (Immersion Gold) 50 View detail

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