4 Layer FR4 PCB Production Record #FR4-20260727-032

For this order, we produced ten standard 4-layer PCBs, each measuring 124 x 25 mm with a thickness of 1.6 mm and 1 oz copper layers. The specifications called for a conventional 6/6 mil minimum track and spacing as well as 0.3 mm holes, without blind vias or impedance control. A matte black soldermask with white silkscreen lettering was chosen, topped with an immersion gold ENIG surface finish for durability and connectivity.

The manufacturing sequence started with engineering review and material preparation, followed by inner layer imaging, circuit etching, and precise layer stack alignment. High pressure lamination ensured solid multilayer construction before solder mask application. We then performed electroless nickel deposition and immersion gold deposition to create a flat, solderable ENIG surface.

Every board passed electrical testing for continuity and isolation. The complete process spanned 4.8 days and resulted in uniformly finished boards that offer reliable performance and an attractive matte appearance suited to the intended application.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→