8 Layer FR4 PCB Production Record #FR4-20260727-043

This order comprised 150 panels of 8-layer FR4 circuit board measuring 42 × 72 mm with 1.6 mm finished thickness and a custom stackup. The 5/5 mil minimum track and spacing demanded precise inner layer imaging, circuit etching, and registration control to preserve copper definition through the multilayer construction. Material preparation and high-pressure lamination were completed with close attention to the specified layer sequence, while 0.2 mm minimum holes required stable drilling parameters across the panel format.

Black solder mask combined with white silkscreen was applied after lamination. The immersion gold ENIG surface finish followed through electroless nickel deposition and immersion gold deposition, delivering flat, oxidation-resistant pads suited to the board geometry. These steps, together with the custom stackup, received particular process tuning to maintain uniformity on every panel.

Electrical testing verified continuity and isolation on all 150 panels, confirming compliance with the tighter geometry and multilayer requirements. The complete sequence from engineering review through final inspection took 5.8 days and produced consistent boards that align with the documented specifications.