4 Layer FR4 PCB Production Record #FR4-20260818-009

This production record covers 100 units of a 4-layer FR4 PCB built to 10.4 x 17.87 mm dimensions and 3 mm thickness using 1 oz copper layers. With a conventional 6/6 mil minimum track and spacing and 0.3 mm minimum hole size, the design followed standard geometry without impedance requirements. We applied matte black solder mask and white legend, then completed the boards with immersion gold ENIG surface finish for superior conductivity and oxidation resistance.

The manufacturing sequence included detailed engineering review, material preparation, inner layer imaging, etching, and precise alignment before high pressure lamination. Solder mask processing was followed by electroless nickel and immersion gold deposition stages. Final electrical testing verified every board met performance criteria.

Completed over 4.4 days, this batch demonstrated consistent layer registration and feature accuracy despite the elevated board thickness. The resulting standard 4-layer FR4 PCBs provide enhanced structural integrity while the ENIG finish ensures reliable assembly and field performance.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→