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6 Layer Rigid-Flex PCB Production Record #RFP-20240514-0035

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 25 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 102.9 x 89.6 mm Copper Weight 1OZ
Thickness 0.8 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Matte Black Silkscreen White

Manufacturing Timeline

Order Created
Apr 29 09:22
Files Ready
Apr 29 09:22
Engineering Review Completed
Apr 29 09:28
Payment down
Apr 29 09:28
Production Started
Apr 29 09:28
Production Completed
May 14 15:03
Progress: 0/6
Engineering Review time: 6 min
Production time: 15.3d

Logistics Information

Production Completed→Shipping : 1.4 h
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
May 14 16:25

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production run consisted of 25 six-layer rigid-flex boards fabricated in panel configuration. Each board measured 102.9 × 89.6 mm with an overall thickness of 0.8 mm, using 1 oz copper, 6/6 mil trace spacing, 0.25 mm minimum holes, matte black solder mask, white silkscreen, and immersion gold ENIG finish. The thin hybrid construction required precise material preparation to ensure proper bend characteristics while maintaining layer registration across the rigid and flex zones.

 

Manufacturing proceeded through inner layer imaging, high-pressure lamination, and dedicated flex-rigid lamination steps to create clean transitions. Controlled depth routing defined the flexible areas accurately before solder mask application and ENIG plating. Dynamic flex reliability testing was performed to confirm the panels could endure repeated bending cycles without circuit degradation.

 

Electrical testing on completed panels verified continuity and isolation across all 25 units. The 35-day schedule accommodated the specialized lamination and validation steps inherent to this rigid-flex specification, resulting in consistent mechanical and electrical performance.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260807-039 Rigid-Flex PCB 6 196 x 90 Green ENIG (Immersion Gold) 30 View detail
RFP-20260708-046 Rigid-Flex PCB 6 205 x 20 Green ENIG (Immersion Gold) 125 View detail
RFP-20260518-038 Rigid-Flex PCB 6 106.5 x 24 Green ENIG (Immersion Gold) 5 View detail

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