6 Layer Rigid-Flex PCB Production Record #RFP-20250526-0064

This production record covers a set of ten 6-layer rigid-flex circuit boards fabricated as panels with dimensions of 171 x 19 mm. The 1.6 mm board thickness and 1 oz copper layers were combined with tighter 4/4 mil geometry and 0.1 mm minimum hole size. Manufacturing steps focused on accurate inner layer imaging, high-pressure lamination, and dedicated flex-rigid lamination to maintain proper alignment and bonding strength at the transition zones.

Following circuit formation, green soldermask and white silkscreen layers were applied prior to the immersion gold ENIG surface finish. The process continued with controlled depth routing for precise panel separation and included dynamic flex reliability testing to confirm the boards would perform under repeated flexing. All units then underwent full electrical testing to validate circuit integrity.

Outcomes from this order show uniform results across the batch, confirming that the executed processes successfully addressed the complexities inherent in 6-layer rigid-flex construction. The completed panels provide the reliability expected for applications requiring both stable rigid areas and flexible interconnects.