6 Layer Rigid-Flex PCB Production Record #RFP-20250715-0083

This production record covers 20 panels of 6-layer rigid-flex printed circuits measuring 196 × 90 mm with a finished thickness of 1.2 mm and 1 oz copper throughout. The design used standard 6/6 mil trace and spacing together with 0.3 mm minimum holes, calling for precise material selection and registration control at the rigid-to-flex transitions. After engineering review and material preparation, inner layer imaging, etching, and careful layer stack alignment preceded both high-pressure lamination and the subsequent flex-rigid lamination steps.

Green soldermask and white silkscreen were applied prior to electroless nickel and immersion gold deposition, producing a uniform ENIG surface finish suited to the board's mixed-material construction. Controlled depth routing delivered clean panel outlines while preserving the flexible zones. Dynamic flex reliability testing was performed to confirm the panels could withstand repeated bending without delamination or trace fracture.

Final electrical testing verified continuity and isolation across all 20 panels, documenting consistent results that matched the customer’s requirements for this rigid-flex configuration. The 29-day schedule accommodated the additional verification steps inherent to reliable rigid-flex execution.