6 Layer Rigid-Flex PCB Production Record #RFP-20250728-0107

This order consisted of 25 six-layer rigid-flex PCB panels measuring 209.3 x 148.6 mm with a board thickness of 1.2 mm. The design specified 1 oz copper, a standard 6/6 mil trace and spacing, 0.2 mm minimum hole size, green solder mask, white silkscreen, and an immersion gold ENIG surface finish. These parameters required careful management during the flex-rigid lamination phase to achieve proper integration of the rigid and flexible zones without introducing stress concentrations.

Manufacturing proceeded through engineering review, material preparation, inner layer imaging, and circuit etching before high-pressure lamination and flex-rigid lamination. Solder mask was applied prior to the electroless nickel deposition and immersion gold deposition steps. Controlled depth routing then prepared the panel edges for separation.

Dynamic flex reliability testing validated the bending endurance of the flexible portions, while electrical testing verified all circuits. The 26-day production window permitted detailed process controls and multiple inspection points, resulting in a uniform set of panels ready for reliable field performance.