PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rigid-Flex PCB | Quantity | 25 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 209.3 x 148.6 mm | Copper Weight | 1OZ |
| Thickness | 1.2 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record details the manufacturing of 25 panels of a 6-layer rigid-flex board, each measuring 209.3 x 148.6 mm with a finished thickness of 1.2 mm. The design used 1 oz copper throughout, standard 6/6 mil track and spacing, 0.2 mm minimum holes, green soldermask, white silkscreen, and immersion gold ENIG surface finish.
The manufacturing sequence featured careful layer stack alignment and flex-rigid lamination to properly fuse the rigid FR4 and flexible sections. Controlled depth routing accurately formed the transition areas, and dynamic flex reliability testing confirmed the structure could handle repeated flex cycles without failure.
Over the 16.2-day production period, all process steps from inner layer imaging through final electrical testing were executed to specification. The delivered panels showed excellent consistency, offering reliable performance for applications that combine multilayer circuitry with mechanical flexibility.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| RFP-20260807-039 | Rigid-Flex PCB | 6 | 196 x 90 | Green | ENIG (Immersion Gold) | 30 | View detail |
| RFP-20260708-046 | Rigid-Flex PCB | 6 | 205 x 20 | Green | ENIG (Immersion Gold) | 125 | View detail |
| RFP-20260518-038 | Rigid-Flex PCB | 6 | 106.5 x 24 | Green | ENIG (Immersion Gold) | 5 | View detail |
