PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rigid-Flex PCB | Quantity | 100 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 205 x 20 mm | Copper Weight | 1OZ |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This 6-layer rigid-flex circuit board order comprised 100 panels with compact dimensions of 205 x 20 mm and standard 1.6 mm thickness. The design utilized 1 oz copper, 6/6 mil line width and spacing, and minimum hole size of 0.3 mm. Immersion gold ENIG surface finish was deposited following electroless nickel to ensure long-term reliability and excellent solderability for the green soldermask and white silkscreen combination.
Execution centered on accurate layer stack alignment and flex-rigid lamination to integrate the flexible circuitry with rigid sections seamlessly. Controlled depth routing defined the flex areas precisely, while avoiding any damage to underlying layers. Dynamic flex reliability testing was conducted to validate the panels' ability to withstand repeated bending as required by the application.
Comprehensive electrical testing confirmed full functionality and consistency across the entire production run. The processes employed delivered dependable rigid-flex boards that met all specified parameters without deviation.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| RFP-20260807-039 | Rigid-Flex PCB | 6 | 196 x 90 | Green | ENIG (Immersion Gold) | 30 | View detail |
| RFP-20260708-046 | Rigid-Flex PCB | 6 | 205 x 20 | Green | ENIG (Immersion Gold) | 125 | View detail |
| RFP-20260518-038 | Rigid-Flex PCB | 6 | 106.5 x 24 | Green | ENIG (Immersion Gold) | 5 | View detail |
