6 Layer Rigid-Flex PCB Production Record #RFP-20250917-0071

Production of these five 6-layer rigid-flex PCBs centered on integrating rigid FR4 sections with flexible polyimide zones. The boards measure 216 by 101.5 mm and arrive at a finished thickness of 1.2 mm using 1 oz copper. Blind vias were drilled and plated alongside a standard 6/6 mil trace and spacing geometry, 0.3 mm minimum holes, green soldermask, and white silkscreen. Immersion gold ENIG surface finish was selected to ensure stable pad surfaces and long-term solderability for the hybrid construction.

Manufacturing followed a sequence of high-pressure lamination, flex-rigid lamination, and controlled depth routing to maintain layer registration while defining precise outlines. Dynamic flex reliability testing subjected the flexible areas to repeated bend cycles, confirming mechanical endurance before final electrical testing verified continuity across all five boards. Each step accounted for the specific material transitions inherent to rigid-flex designs.

The 14.9-day schedule permitted thorough verification at every stage, resulting in consistent layer alignment and reliable performance from the completed batch.