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6 Layer Rigid-Flex PCB Production Record #RFP-20250917-0071

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 6 Layers Board Type Single PCB
Dimensions 216 x 101.5 mm Copper Weight 1OZ
Thickness 1.2 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Sep 02 15:34
Files Ready
Sep 02 15:34
Engineering Review Completed
Sep 02 16:34
Payment down
Sep 02 16:34
Production Started
Sep 02 16:39
Production Completed
Sep 17 13:56
Progress: 0/6
Engineering Review time: 1h
Production time: 14.9d

Logistics Information

Production Completed→Shipping : 0.5 h
Carrier
DHL
Destination
SWITZERLAND
Shipping Method
Express Air
Shipping Time
Sep 17 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

Production of these five 6-layer rigid-flex PCBs centered on integrating rigid FR4 sections with flexible polyimide zones. The boards measure 216 by 101.5 mm and arrive at a finished thickness of 1.2 mm using 1 oz copper. Blind vias were drilled and plated alongside a standard 6/6 mil trace and spacing geometry, 0.3 mm minimum holes, green soldermask, and white silkscreen. Immersion gold ENIG surface finish was selected to ensure stable pad surfaces and long-term solderability for the hybrid construction.

 

Manufacturing followed a sequence of high-pressure lamination, flex-rigid lamination, and controlled depth routing to maintain layer registration while defining precise outlines. Dynamic flex reliability testing subjected the flexible areas to repeated bend cycles, confirming mechanical endurance before final electrical testing verified continuity across all five boards. Each step accounted for the specific material transitions inherent to rigid-flex designs.

 

The 14.9-day schedule permitted thorough verification at every stage, resulting in consistent layer alignment and reliable performance from the completed batch.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260708-046 Rigid-Flex PCB 6 205 x 20 Green ENIG (Immersion Gold) 125 View detail
RFP-20260518-038 Rigid-Flex PCB 6 106.5 x 24 Green ENIG (Immersion Gold) 5 View detail
RFP-20260127-036 Rigid-Flex PCB 6 149.1 x 209.3 Green ENIG (Immersion Gold) 25 View detail

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