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6 Layer Rigid-Flex PCB Production Record #RFP-20251208-0053

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 80 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 55 x 25.5 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Matte Black Silkscreen White

Manufacturing Timeline

Order Created
Sep 30 12:11
Files Ready
Sep 30 12:11
Engineering Review Completed
Sep 30 14:11
Payment down
Sep 30 14:16
Production Started
Sep 30 14:16
Production Completed
Oct 28 19:15
Progress: 0/6
Engineering Review time: 2h
Production time: 28.3d

Logistics Information

Production Completed→Shipping : 41.0d
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Dec 08 18:56

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This rigid-flex PCB production comprised 80 panels of 6-layer construction, measuring 55 x 25.5 mm with 1.0 mm thickness. Key features included blind vias, 1oz copper, 0.15mm min hole size, 6/6 mil traces, matte black soldermask, white silkscreen, and immersion gold ENIG finish. These elements required precise handling during the flex-rigid lamination and surface finishing stages to maintain integrity across material transitions.

 

Processes encompassed inner layer imaging, high pressure lamination, flex-rigid bonding, solder mask application, and nickel/gold deposition. Controlled depth routing was applied to the panel layout. Dynamic flex reliability testing and electrical testing confirmed performance and consistency throughout the batch.

 

The order was completed in 28.3 days, yielding boards that met all specified requirements for this blind-via rigid-flex design.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260708-046 Rigid-Flex PCB 6 205 x 20 Green ENIG (Immersion Gold) 125 View detail
RFP-20260518-038 Rigid-Flex PCB 6 106.5 x 24 Green ENIG (Immersion Gold) 5 View detail
RFP-20260127-036 Rigid-Flex PCB 6 149.1 x 209.3 Green ENIG (Immersion Gold) 25 View detail

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