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4 Layer Rigid-Flex PCB Production Record #RFP-20260113-004

Rigid-Flex PCB 4 Layers ENIG (Immersion Gold) Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 135 x 150.5 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Dec 10 15:20
Files Ready
Dec 10 15:20
Engineering Review Completed
Dec 10 16:06
Payment down
Dec 15 21:44
Production Started
Dec 15 21:48
Production Completed
Dec 30 14:51
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 14.8d With Engineering Questions

Logistics Information

Production Completed→Shipping : 13.9d
Carrier
DHL
Destination
FRANCE
Shipping Method
Express Air
Shipping Time
Jan 13 10:59

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production record covers five 4-layer rigid-flex PCBs, each measuring 135 × 150.5 mm with 1.6 mm overall thickness and 1 oz copper. The design used a conventional 6/6 mil trace and spacing geometry, 0.3 mm minimum holes, green solder mask, and white silkscreen. Immersion gold ENIG surface finish was selected to ensure stable contact resistance across both rigid and flexible zones. Material preparation and layer stack alignment received close attention to maintain registration between the FR4 rigid sections and the polyimide flex layers during bonding.

 

Manufacturing followed a sequence of inner layer imaging, high-pressure lamination, flex-rigid lamination, and controlled depth routing to create clean bend transitions without damaging the flex circuitry. Solder mask application was followed by electroless nickel deposition and immersion gold plating. Dynamic flex reliability testing was performed to confirm the circuit integrity under repeated bending, while full electrical testing verified net continuity and isolation on every board.

 

The entire order was completed in 14.8 days. All five rigid-flex PCBs met the specified requirements, demonstrating consistent layer registration and reliable flex-to-rigid interfaces suitable for compact electronic assemblies.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260429-041 Rigid-Flex PCB 4 119.87 x 109.66 Green ENIG (Immersion Gold) 5 View detail
RFP-20260427-010 Rigid-Flex PCB 4 131.97 x 115.05 Green ENIG (Immersion Gold) 260 View detail
RFP-20260401-039 Rigid-Flex PCB 4 138 x 128 Green ENIG (Immersion Gold) 5 View detail

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