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Multilayer Rigid-Flex PCB Production Record #RFP-20260920-044

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 82.14 x 69.1 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Aug 06 08:59
Files Ready
Aug 06 08:59
Engineering Review Completed
Aug 06 09:45
Payment down
Aug 06 09:45
Production Started
Aug 06 09:45
Production Completed
Aug 31 10:47
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 25.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.9 h
Carrier
DHL
Destination
CANADA
Shipping Method
Express Air
Shipping Time
Aug 31 11:36

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Flex-Rigid Lamination
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
TDR Impedance Testing
15
Dynamic Flex Reliability Testing
16
Electrical Testing

Manufacturing Summary

This order comprised five 8-layer rigid-flex PCBs produced in panel format, with dimensions of 82.14 x 69.1 mm and a finished thickness of 1.6 mm using 1 oz copper. The boards incorporated tight 3 mil trace and spacing geometry, 0.2 mm minimum hole size, green soldermask, white silkscreen, and immersion gold ENIG surface finish. Due to the rigid-flex design, stackup impedance engineering and precise layer alignment were prioritized to achieve the required electrical performance.

 

Execution involved material preparation, circuit imaging and etching, high pressure lamination, and specialized flex-rigid lamination. Solder mask coating preceded the electroless nickel and immersion gold deposition. Controlled depth routing defined the transition zones, ensuring clean separation between rigid and flex regions without damaging the flexible layers.

 

Subsequent TDR impedance testing and dynamic flex reliability testing verified both electrical and mechanical integrity. All panels met specifications during electrical testing. The 25-day manufacturing cycle accommodated the detailed process controls and multiple validation steps necessary for this impedance controlled rigid-flex PCB run.

 

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260324-002 Rigid-Flex PCB 8 21.8 x 58.11 Green ENIG (Immersion Gold) 5 View detail

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