6 Layer Rogers PCB Production Record #ROG-20260711-0002
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rogers PCB | Quantity | 5 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 86.24 x 60.25 mm | Copper Weight | 1oz |
| Thickness | 1.2 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Material Type | Rogers/RO4003C |
This 6-layer Rogers RO4003C panel order, quantity 5 pieces at 86.24 × 60.25 mm and 1.2 mm thickness, used 1 oz copper, 4/4 mil minimum track/spacing, 0.2 mm minimum holes, green solder mask, white silkscreen, and ENIG finish. The high-frequency material, controlled-impedance requirement, and via resin plugging made dielectric consistency and via reliability the central process considerations. Customer-supplied stack-up and target impedance values were reviewed against actual laminate behavior; line widths, spacings, and the layer stack were adjusted within agreed limits so that the finished Rogers PCBs would meet the electrical specification without altering critical routing density.
Resin plugging was required on the vias, yet some of those vias carried solder-mask openings in the original data. The openings were closed where plugging was mandatory to prevent resin bleed and ensure solid fill. Characters located outside the board outline were removed prior to production. Characters placed on large solder-mask openings were evaluated and retained only where functionally necessary. Copper features that crossed the V-cut lines were pulled back or the cut path offset to eliminate edge copper exposure after singulation. These controlled changes, following the same resin plugging and impedance compensation approach applied on earlier Rogers builds, produced panels that satisfied both the material and electrical requirements with consistent registration and reliable delivery.
Discover how AIVON manufactures 6 Layer Rogers PCBs, including complex high-frequency stackup design, advanced material processing, impedance control requirements, manufacturing challenges, and real production experience from customer orders.
Master troubleshooting common Rogers PCB manufacturing challenges including drilling defects, plating adhesion, delamination, and CTE mismatch. Learn practical solutions, process adjustments, and DFM tips to improve yield for high-frequency RO4000, RO4350B, and PTFE-based boards.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| ROG-20260709-0001 | Rogers PCB | 6 | 88 x 156 | Blue | ENIG (Immersion Gold) | 5 | View detail |
| ROG-20221110-0103 | Rogers PCB | 6 | 73.66 x 50.8 | Green | ENIG (Immersion Gold) | 20 | View detail |
| ROG-20220623-0039 | Rogers PCB | 6 | 50.8 x 73.7 | Green | ENIG (Immersion Gold) | 20 | View detail |
