ENIG and Wire Bonding: Ensuring Robust Connections in Modern Electronics
Explore the compatibility of ENIG surface finish with gold and aluminum wire bonding for advanced PCB packaging, focusing on strength and preparation.
Explore the compatibility of ENIG surface finish with gold and aluminum wire bonding for advanced PCB packaging, focusing on strength and preparation.
Discover how to choose the ideal prepreg thickness for high-speed PCB designs to ensure signal integrity, control impedance, and minimize signal loss in advanced electronic applications.
A practical guide to identifying, troubleshooting, and repairing common plated through-hole (PTH) defects in PCBs, including cracks, voids, and connection issues.
Learn how to calculate impedance of transmission lines for high-speed PCB designs, covering microstrip, stripline, and coplanar waveguide methods.
Delve into the world of 8-layer PCBs, understanding their structure, high-performance applications, critical design considerations, and advanced manufacturing processes for complex electronics.
Explore 6-layer PCB trends shaping future technology, from high-density interconnects and embedded components to advanced materials. Discover innovations for efficient designs in telecom and IoT. AIVON guides your next project with expert insights.
Discover how solder mask dielectric constant and loss tangent impact high-frequency PCB performance. Learn to choose low-loss solder mask materials for superior signal integrity.
Learn strategic via placement techniques for 4-layer PCBs to enhance signal integrity, manage power delivery, and control impedance, ensuring reliable and efficient board performance.
Learn the basics of FR-4 PCB design, from material understanding to creating single and double-layer boards using popular software like KiCad, Eagle, and Altium.
Explore the essentials of flexible PCBs for smart glasses, including material selection, flex PCB design rules, bending radius considerations, and the rigid-flex assembly process for wearable devices.
Learn key principles of solder paste stencil aperture design, including thickness, size, and material, to achieve precise SMT assembly and minimize defects.
Master soldering techniques for aluminum PCBs, including temperature control, solder paste selection, and methods for both reflow and hand soldering, to ensure strong joints in high-power applications.