PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 75 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 216 x 97 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Matte Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production run consisted of 75 four-layer FR4 panel PCBs measuring 216 × 97 mm and built to a standard 1.6 mm thickness with 1 oz copper. We processed the order through inner layer imaging, precise etching to the 6/6 mil geometry, and high-pressure lamination using the default stackup. The 0.15 mm minimum hole size required accurate drilling and plating sequences that remained consistent across the entire panel format.
Matte green solder mask was applied and followed by white silkscreen legend. Electroless nickel deposition and immersion gold deposition produced a uniform ENIG surface finish, providing stable solderability without impedance control requirements. Every panel completed full electrical testing to verify net continuity and isolation before final inspection.
The complete manufacturing cycle took 6.2 days and delivered panels that met all specified tolerances. Execution focused on maintaining registration during multilayer bonding and repeatable plating results, ensuring reliable performance for this medium-volume standard 4-layer FR4 order.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
