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4 Layer FR4 PCB Production Record #FR4-20251216-009

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 190.8 x 278.4 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 08 19:17
Files Ready
Dec 08 19:17
Engineering Review Completed
Dec 08 19:17
Payment down
Dec 08 21:32
Production Started
Dec 08 21:33
Production Completed
Dec 14 03:31
Progress: 0/6
Production time: 5.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2.3d
Carrier
DHL
Destination
SLOVAKIA
Shipping Method
Express Air
Shipping Time
Dec 16 09:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This production record covers five panels of a standard 4-layer FR4 PCB, sized at 190.8 x 278.4 mm and built to 1.6 mm thickness with 1 oz copper layers. With a conventional minimum feature size of 6 mil and no impedance control requirements, the build focused on achieving a uniform green solder mask and high-quality immersion gold ENIG finish without silkscreen. These choices required specific attention to mask alignment and plating consistency across the relatively large panel area.

 

The team completed engineering review and material preparation, followed by inner layer imaging, circuit etching, and precise layer stack alignment before high-pressure lamination. Solder mask application preceded electroless nickel and immersion gold deposition steps that produced flat, oxidation-resistant pad surfaces. All five panels then passed full electrical testing that verified continuity and isolation across every net.

 

Manufacturing concluded in 5.3 days with consistent layer registration and plating thickness that aligned with the default stackup and specified parameters, delivering boards ready for reliable assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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