4 Layer FR4 PCB Production Record #FR4-20251220-020

This production record covers 100 panels of standard 4-layer FR4 PCBs, each measuring 171 × 114.8 mm with 1.6 mm thickness, 1 oz copper, and a custom stackup. Material preparation and inner layer imaging were followed by precise circuit etching and layer stack alignment before high-pressure lamination. The 6/6 mil track spacing and 0.3 mm minimum holes fell within conventional parameters, allowing the process to focus on registration accuracy across the panel format while meeting the specified matte green soldermask and white silkscreen combination.

Immersion gold ENIG surface finish was formed through controlled electroless nickel deposition and gold immersion, delivering a flat, oxidation-resistant pad surface without impedance control requirements. Solder mask application and final electrical testing verified continuity and isolation on every panel, confirming that the custom stackup maintained structural integrity throughout the multilayer construction.

The complete sequence from engineering review to testing was executed in 5.3 days, producing panels with consistent layer alignment and surface quality ready for downstream assembly.