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4 Layer FR4 PCB Production Record #FR4-20260105-009

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 300 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 418 x 38 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 05 10:59
Files Ready
Dec 05 10:59
Engineering Review Completed
Dec 05 10:59
Payment down
Dec 05 19:49
Production Started
Dec 05 19:51
Production Completed
Dec 16 07:31
Progress: 0/6
Production time: 10.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 20.5d
Carrier
无需发货
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Jan 05 17:39

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This production record details the manufacturing of 300 standard 4-layer FR4 PCBs characterized by their extended 418 x 38 mm footprint and slim 0.8 mm thickness. These boards featured 1 oz copper layers with conventional 6 mil track and spacing rules, along with minimum hole sizes of 0.3 mm. The application of green soldermask, white silkscreen, and immersion gold ENIG finish provided a durable and assembly-friendly surface without the need for impedance control.

 

Given the thin multilayer construction and high aspect ratio, we emphasized controlled lamination parameters and layer alignment to maintain flatness and interlayer registration. The process sequence included circuit imaging and etching, solder mask coating, and precise nickel-gold plating. All boards then advanced through automated optical inspection and electrical testing to validate integrity across the full batch.

 

Completed in 10.5 days, this run delivered reliable boards tailored to the specified parameters, reflecting effective process management for thin, elongated multilayer designs.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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