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8 Layer FR4 PCB Production Record #FR4-20260113-025

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 180 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 207.5 x 271 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Jan 04 21:16
Files Ready
Jan 04 21:16
Engineering Review Completed
Jan 06 16:05
Payment down
Jan 05 18:59
Production Started
Jan 06 16:09
Production Completed
Jan 13 22:59
Progress: 0/6
Engineering Review time: 1.8d Multiple File Revisions
Production time: 7.3d

Logistics Information

Production Completed→Shipping : 8 min
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Jan 13 23:07

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This production record covers 180 eight-layer PCBs built on FR4 material with a custom stackup to support impedance control. The panels measure 207.5 by 271 mm at 1.6 mm thickness using 1 oz copper throughout. With a minimum trace width and spacing of 6 mil and drilled holes down to 0.2 mm, these boards incorporate green soldermask, white silkscreen, and immersion gold ENIG finish for reliable connectivity.

 

Engineering focused on stackup impedance modeling and trace width compensation before proceeding to inner layer imaging, etching, and precision lamination. Layer stack alignment was verified at each stage to preserve the integrity of the multilayer construction during high-pressure processing.

 

After solder mask application, the ENIG surface was formed through sequential nickel and gold deposition. Comprehensive TDR impedance testing and electrical testing validated performance across the full set of panels. Completed over 7.3 days, the run produced consistent boards that meet the electrical and mechanical specifications required for this impedance controlled PCB application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260819-043 FR4 PCB 10 157 x 140 Blue ENIG (Immersion Gold) 100 View detail
FR4-20260818-014 FR4 PCB 2 110.32 x 173.3 Green ENIG (Immersion Gold) 200 View detail
FR4-20260811-033 FR4 PCB 8 226.8 x 109 Green ENIG (Immersion Gold) 50 View detail

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