PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 180 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 207.5 x 271 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers 180 eight-layer PCBs built on FR4 material with a custom stackup to support impedance control. The panels measure 207.5 by 271 mm at 1.6 mm thickness using 1 oz copper throughout. With a minimum trace width and spacing of 6 mil and drilled holes down to 0.2 mm, these boards incorporate green soldermask, white silkscreen, and immersion gold ENIG finish for reliable connectivity.
Engineering focused on stackup impedance modeling and trace width compensation before proceeding to inner layer imaging, etching, and precision lamination. Layer stack alignment was verified at each stage to preserve the integrity of the multilayer construction during high-pressure processing.
After solder mask application, the ENIG surface was formed through sequential nickel and gold deposition. Comprehensive TDR impedance testing and electrical testing validated performance across the full set of panels. Completed over 7.3 days, the run produced consistent boards that meet the electrical and mechanical specifications required for this impedance controlled PCB application.
Explore More PCB Manufacturing Resources
8 Layer FR4 PCB Manufacturing Insights
Discover how AIVON manufactures 8 Layer FR4 PCBs, including advanced multilayer structures, signal integrity requirements, impedance control, fabrication processes, manufacturing challenges, and real production experience from customer orders.
How to Avoid Common Engineering Queries in Multilayer FR4 PCB Design
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260819-043 | FR4 PCB | 10 | 157 x 140 | Blue | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260818-014 | FR4 PCB | 2 | 110.32 x 173.3 | Green | ENIG (Immersion Gold) | 200 | View detail |
| FR4-20260811-033 | FR4 PCB | 8 | 226.8 x 109 | Green | ENIG (Immersion Gold) | 50 | View detail |