8 Layer FR4 PCB Production Record #FR4-20260129-065

This production record covers 30 panels of 8-layer PCBs measuring 226.8 × 109 mm with 1.0 mm finished thickness and 1 oz copper weight. The design specified a tighter 4/4 mil trace and spacing geometry together with 0.2 mm minimum holes, supported by a custom stackup that compressed eight layers into the target thickness while maintaining registration across the panel format.

Manufacturing began with engineering review of the stackup, followed by inner layer imaging, circuit etching, and high-pressure lamination to secure layer alignment. Green soldermask and white silkscreen were applied prior to electroless nickel and immersion gold deposition, producing a flat, oxidation-resistant ENIG surface suited to the fine-pitch layout and assembly requirements.

Full electrical testing verified continuity and isolation on every panel. The complete sequence, executed without deviation from the defined process parameters, required 12.3 days and delivered boards exhibiting consistent edge definition, plating uniformity, and solder mask registration.