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8 Layer FR4 PCB Production Record #FR4-20260228-130

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 30 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 226.8 x 109 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 13 15:22
Files Ready
Feb 13 15:22
Engineering Review Completed
Feb 13 16:08
Payment down
Feb 13 19:22
Production Started
Feb 13 19:23
Production Completed
Feb 28 06:19
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 14.5d

Logistics Information

Production Completed→Shipping : 3.5 h
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Feb 28 09:47

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This manufacturing summary details the production of 30 8-layer FR4 panels, each 226.8 by 109 mm with a 1.0 mm thickness and custom stackup. The tighter 4/4 mil track and spacing, combined with 0.2 mm minimum holes, necessitated precise circuit imaging, etching, and plating processes to maintain feature accuracy without compromising board integrity. No impedance control was required, allowing standard signal routing within the multilayer construction.

 

Green soldermask with white silkscreen offered good visibility, topped by an immersion gold ENIG surface finish for superior solderability and protection against oxidation. The process flow incorporated detailed layer stack alignment and high-pressure lamination to bond the eight layers reliably, followed by solder mask application and final surface finishing steps.

 

Completed over 14.5 days, the run from material preparation through electrical testing confirmed all interlayer connections and overall panel performance. The resulting boards exhibited uniform quality in a panelized format, supporting consistent downstream assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260819-043 FR4 PCB 10 157 x 140 Blue ENIG (Immersion Gold) 100 View detail
FR4-20260818-014 FR4 PCB 2 110.32 x 173.3 Green ENIG (Immersion Gold) 200 View detail
FR4-20260811-033 FR4 PCB 8 226.8 x 109 Green ENIG (Immersion Gold) 50 View detail

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