PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 100 pcs |
| Layers | 10 Layers | Board Type | Panel PCB |
| Dimensions | 50 x 40 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Matte Black | Silkscreen | White |
| Stack-up | Custom | Impedance Control | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
The order called for 100 panels of a 10-layer impedance controlled PCB built on FR4 with 1.6 mm thickness and 1 oz copper weight. Featuring a custom stackup, 5/5 mil minimum track and spacing, and 0.2 mm holes, the job demanded careful engineering. We completed stackup impedance engineering and applied trace width compensation during the imaging and etching stages to meet the specified impedance values accurately.
High pressure lamination secured layer alignment across the multilayer construction before proceeding to solder mask application in matte black with white silkscreen. The immersion gold ENIG surface finish was achieved through controlled electroless nickel deposition followed by gold immersion, providing reliable connectivity for this panelized run.
TDR impedance testing and comprehensive electrical testing followed on the completed panels. This execution for the 10-layer impedance controlled PCB with matte black soldermask resulted in all 100 panels meeting the tight tolerances and performance criteria without deviation.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260819-043 | FR4 PCB | 10 | 157 x 140 | Blue | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260818-014 | FR4 PCB | 2 | 110.32 x 173.3 | Green | ENIG (Immersion Gold) | 200 | View detail |
| FR4-20260811-033 | FR4 PCB | 8 | 226.8 x 109 | Green | ENIG (Immersion Gold) | 50 | View detail |
