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4 Layer FR4 PCB Production Record #FR4-20260505-022

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 120 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 22 x 45.5 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Mar 25 18:03
Files Ready
Mar 25 18:03
Engineering Review Completed
Mar 25 19:52
Payment down
Mar 25 15:52
Production Started
Mar 26 09:16
Production Completed
Mar 31 21:10
Progress: 0/6
Engineering Review time: 2h
Production time: 5.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 34.6d
Carrier
DHL
Destination
ITALY
Shipping Method
Express Air
Shipping Time
May 05 11:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 22 × 45.5 mm with a thin 0.8 mm thickness, TG150 material, and 1 oz copper on both sides. Produced as 120 pieces in 4×2 panels for 15 sets, the order used ENIG surface finish with 3 µin gold thickness, green solder mask on both sides, and no silkscreen layers. Minimum holes were 0.3 mm with standard 6 mil line/space. Process edges of 4 mm on the top and bottom sides supported V-cut separation. The 3-day schedule included 100% flying probe testing. Customer requirements specified sequential ID numbering on the solder-mask layer in accordance with IPC-4552 recommendations and the addition of a UL mark.

 

DFM review focused on marking placement constraints. The supplied data contained no silkscreen layers, so sequential ID numbers could only be applied on the solder-mask surface; the originally designated location lacked sufficient space. UL marking was requested on the bottom solder mask, which also had no available area; placement was therefore proposed on the top solder mask at an alternative position. The UL frame area itself was too small to accommodate the mark, leading to a proposed swap with the nearby LMP location to maintain legibility without reducing board clearance.

 

Confirmed marking locations and sequential ID application were implemented prior to production. The compact boards achieved consistent ENIG plating and clear identification markings within the accelerated timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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