8 Layer FR4 PCB Production Record #FR4-20260703-031

These 8-layer FR4 PCBs were produced as 20 panels measuring 179 x 157 mm at 1.6 mm thickness with 1 oz copper. The design included blind vias, a custom stackup, and 4/4 mil minimum track spacing, requiring precise inner layer imaging, etching, and registration control to maintain feature accuracy across all layers. Material preparation emphasized clean foil surfaces and stable prepreg to support the 0.2 mm minimum holes without compromising plating quality.

Layer stack alignment and high-pressure lamination bonded the eight layers reliably before black soldermask and white silkscreen application. Electroless nickel deposition followed by immersion gold created a uniform ENIG surface finish, delivering flat pads and good oxidation resistance suited to the board complexity. The full sequence concluded with comprehensive electrical testing that verified continuity and isolation on every panel.

The 23-day production window permitted methodical execution of each process step, resulting in consistent via formation, copper distribution, and solder mask registration. All boards met the specified parameters with no rework required, providing the customer with dependable multilayer panels ready for assembly.