8 Layer FR4 PCB Production Record #FR4-20260707-022

These thirty 8-layer FR4 panel PCBs measured 226.8 × 109 mm with a finished thickness of 1.0 mm and a custom stackup using 1 oz copper throughout. The 4/4 mil minimum trace and spacing required precise inner-layer imaging, etching, and registration during high-pressure lamination to preserve feature accuracy across the panels. A 0.2 mm minimum hole size further guided drill program optimization and plating parameters, keeping the entire run within standard multilayer process windows while respecting the thinner profile.

Green solder mask and white silkscreen were applied after lamination, followed by electroless nickel deposition and immersion gold plating to form a uniform ENIG surface finish. This sequence ensured clean pad definition and reliable solderability without affecting the fine conductors. Electrical testing of all nets on the completed panels verified continuity and isolation, confirming that the 10.5-day production cycle delivered consistent boards meeting every specified dimension and tolerance.