High Layer Count FR4 PCB Production Record #FR4-20260720-047

These 10-layer FR4 panel PCBs were produced as 75 units with panel dimensions of 316.87 × 78.436 mm and a finished board thickness of 1.5 mm. The custom stackup and impedance control requirements drove detailed stackup impedance engineering and trace width compensation prior to inner layer imaging and etching. High-pressure lamination maintained precise layer alignment across the elongated panel format while processing standard 1 oz copper and 6/6 mil geometry.

Green soldermask with white silkscreen was applied, followed by electroless nickel and immersion gold deposition to create a uniform ENIG surface finish. TDR impedance testing verified the controlled impedance parameters on the finished panels, after which full electrical testing confirmed continuity and isolation. The 0.25 mm minimum hole size fit comfortably within established drilling capabilities for this build.

The 53.5-day production window allowed complete execution of every process step without compromise, resulting in consistent panel quality and reliable electrical performance across the full order of these impedance controlled PCBs.