PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 30 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 226.8 x 109 mm | Copper Weight | 1oz |
| Thickness | 1 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers an 8-layer FR4 PCB manufactured in panel format with a quantity of 30. Each board measures 226.8 x 109 mm and was built to a 1.0 mm thickness using a custom stackup with 1 oz copper. The 4/4 mil minimum track and spacing demanded precise control in the imaging and etching phases to maintain feature integrity across the panels.
Material preparation and layer stack alignment preceded high pressure lamination, ensuring accurate registration in the absence of blind vias. Green soldermask was applied with white silkscreen, followed by electroless nickel and immersion gold ENIG surface finish. The specified 0.2 mm minimum hole size was achieved consistently.
Electrical testing at the conclusion validated performance across the batch. The order moved through all key processes and reached completion in 6.7 days, delivering reliable multilayer circuit boards that align with the provided specifications.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260819-043 | FR4 PCB | 10 | 157 x 140 | Blue | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260818-014 | FR4 PCB | 2 | 110.32 x 173.3 | Green | ENIG (Immersion Gold) | 200 | View detail |
| FR4-20260811-033 | FR4 PCB | 8 | 226.8 x 109 | Green | ENIG (Immersion Gold) | 50 | View detail |
