6 Layer HDI PCB Production Record #HDI-20251022-0006

This production record covers five panels of 6-layer High-Density Interconnect board with blind vias, built to dimensions of 68 x 116 mm and 1.0 mm thickness using 1 oz copper layers. The HDI structure required sequential lamination after initial layers, combined with laser microvia drilling to create the blind vias at a minimum hole size of 0.15 mm. We processed the 4/4 mil track and spacing through detailed circuit imaging and etching, maintaining feature accuracy across the panels.

Blue soldermask and white silkscreen were applied after lamination, followed by electroless nickel deposition and immersion gold ENIG to deliver a flat, reliable surface finish. Via filling and plating steps ensured solid interconnects within the microvias. Final electrical testing confirmed continuity and isolation on every panel.

The full manufacturing sequence from material preparation through high-pressure lamination and testing was executed to support the tighter geometry and HDI requirements, resulting in consistent quality for this specific order.