PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 5 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 58 x 116 mm | Copper Weight | 1oz |
| Thickness | 1 mm | Min Track / Spacing | 3/3mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Blue | Silkscreen | White |
| HDI Structure | 2 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers five 6-layer HDI PCBs built as panels measuring 58 by 116 mm with 1.0 mm thickness and 1 oz copper. The design specified 3/3 mil trace and spacing, blind vias, and a 2-step HDI structure. Sequential lamination, laser microvia drilling, and via filling with plating were executed to maintain precise layer registration and interconnect reliability on this tighter geometry.
Blue soldermask and white silkscreen preceded immersion gold ENIG surface finish, selected for its flat topography and long-term solderability. Material preparation, inner layer imaging, circuit etching, and high-pressure lamination followed parameters matched to the 0.15 mm minimum hole size. Electrical testing confirmed continuity across all five panels without impedance control requirements.
The completed HDI PCBs showed consistent via plating and surface quality, delivering dependable boards suited to compact electronics applications.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
