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6 Layer HDI PCB Production Record #HDI-20251104-0062

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 30 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 23.7 x 14.4 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Black Silkscreen White
HDI Structure 1 Blind/Buried Vias Yes

Manufacturing Timeline

Order Created
Oct 13 10:43
Files Ready
Oct 13 10:43
Engineering Review Completed
Oct 17 11:19
Payment down
Oct 17 11:19
Production Started
Oct 17 11:19
Production Completed
Nov 03 20:29
Progress: 0/6
Engineering Review time: 4.1d Multiple File Revisions
Production time: 17.4d

Logistics Information

Production Completed→Shipping : 0.9d
Carrier
DHL
Destination
INDIA
Shipping Method
Express Air
Shipping Time
Nov 04 15:55

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Sequential Lamination
08
Laser Microvia Drilling
09
Via Filling & Plating
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Electrical Testing

Manufacturing Summary

The production record for this High-Density Interconnect PCB order covered 30 panels built to 6 layers with blind vias in a 1+n+1 configuration. At 0.8 mm finished thickness and with overall panel dimensions of 23.7 by 14.4 mm, the design incorporated 4/4 mil minimum track and spacing as well as 0.1 mm laser-drilled holes. These parameters required sequential lamination after the initial laser microvia drilling and plating steps.

 

We prepared the materials and performed precise layer stack alignment prior to high-pressure lamination to maintain the tight registration needed for this geometry. Following circuit formation, black soldermask and white legend were applied before the electroless nickel and immersion gold deposition. Electrical testing at the end confirmed that all 30 panels met the design criteria for continuity and isolation.

 

The complete manufacturing cycle took 17.4 days from initial engineering review through final inspection. This execution highlights the process controls applied to produce consistent HDI PCBs with ENIG finish for reliable downstream assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260729-036 HDI PCB 8 97 x 93.4 Black ENIG (Immersion Gold) 100 View detail
HDI-20260720-0001 HDI PCB 8 188 x 100 Matte Black ENIG (Immersion Gold) 125 View detail
HDI-20260718-0002 HDI PCB 4 37 x 26.6 Green ENIG (Immersion Gold) 20 View detail

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