8 Layer HDI PCB Production Record #HDI-20251104-0077

This order comprised five 8-layer HDI PCBs built as panels measuring 77.6 × 63 mm with 1.5 mm finished thickness and 1 oz copper. The 2-step HDI structure required blind vias and laser-drilled 0.1 mm microvias alongside 4/4 mil trace and spacing, paired with a custom stackup. Sequential lamination was performed to register the build-up layers accurately while maintaining registration across the tighter geometry.

After inner layer imaging and etching, we executed laser microvia drilling, followed by via filling and plating to ensure solid copper connections. Green soldermask and white silkscreen were applied prior to electroless nickel and immersion gold deposition, producing a uniform ENIG surface finish. The absence of impedance control allowed standard routing rules, yet the HDI via geometry still demanded precise plating control throughout the 19.9-day schedule.

Electrical testing on every panel verified continuity and isolation, confirming that the finished boards met all dimensional and plating requirements for this HDI PCB configuration.