4 Layer HDI PCB Production Record #HDI-20251206-0038

This 4-layer High-Density Interconnect Board order was completed as five panels, each 110 x 131 mm in size and 1.0 mm in thickness, using 1 oz copper and a custom stackup. The design specified blind vias with a 1-step HDI structure, which we realized through laser microvia drilling and sequential lamination. The 3/3 mil minimum track spacing represented tighter geometry that called for specialized handling in the circuit imaging and etching phases to ensure clean traces.

Following layer stack alignment and high pressure lamination, we applied matte black soldermask with white silkscreen. The surface was then finished with electroless nickel and immersion gold ENIG deposition. Via filling and plating steps were critical for the blind vias, after which each panel received full electrical testing to confirm integrity.

The manufacturing process extended over 22.9 days, allowing adequate time for all quality checks on this small batch. The resulting boards demonstrate solid execution for advanced HDI designs, delivering the expected reliability in a panel PCB format without impedance control specifications.