6 Layer HDI PCB Production Record #HDI-20251213-0004

Production of this 6-layer HDI circuit board with 1-step structure required sequential lamination and laser microvia drilling to form the blind vias on the 81 × 173 mm boards. The 1.6 mm finished thickness combined with 2 oz copper weight demanded precise high-pressure lamination, via filling, thick copper electroplating, and controlled etching to maintain 0.15 mm minimum holes and 6/6 mil geometry across the 20-piece single-board run. Custom stackup details were resolved during engineering review and inner layer imaging to achieve reliable layer registration without impedance control.

Green soldermask and white silkscreen layers were followed by electroless nickel deposition and immersion gold plating, delivering a uniform ENIG surface finish suited to the board's connectivity requirements. Every process step, from material preparation through circuit etching and solder mask application, was executed to support the HDI interconnect integrity while respecting the specified copper distribution.

Final electrical testing verified continuity and isolation on all boards, confirming consistent results after the 19.2-day manufacturing cycle. The completed HDI PCBs with immersion gold ENIG met the order's technical parameters and were prepared for reliable downstream assembly.