6 Layer HDI PCB Production Record #HDI-20251213-0011

This order consisted of 10 panels of 6-layer HDI PCBs, each measuring 111 x 158 mm with 0.8 mm thickness. The 2-step HDI structure utilized blind vias formed by laser microvia drilling after sequential lamination. We managed the tight 3/3 mil minimum track and spacing on 1 oz copper layers through precise circuit imaging and etching, followed by via filling and plating to secure reliable interconnections on the thinner material.

We followed the custom stackup during high pressure lamination to maintain layer alignment. Matte black soldermask was applied, after which we performed electroless nickel and immersion gold deposition to create the ENIG surface finish before adding white silkscreen. Electrical testing confirmed circuit integrity across the batch.

Production for this HDI PCB order with blind vias and tight geometry spanned 29.9 days, resulting in panels that met all dimensional and functional requirements with consistent via plating and trace definition.