PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 500 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 152.5 x 114 mm | Copper Weight | 2oz |
| Thickness | 1.8 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Blue | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
Production of this 8-layer HDI PCB order centered on a three-stage build with blind vias, executed through sequential lamination and laser microvia drilling. The panels, sized at 152.5 x 114 mm, incorporated 2 oz copper on a 1.8 mm finished thickness. Via filling and plating steps were completed prior to controlled copper etching to achieve the required circuit definition at 6/6 mil geometry.
Blue soldermask and white silkscreen were applied over the immersion gold ENIG surface finish, selected for its compatibility with the board's high-density interconnects and long-term reliability. The 0.2 mm minimum hole size integrated well with the overall HDI configuration.
Across the 500-panel run, which spanned 26 days, engineering review, inner layer imaging, and batch electrical testing ensured all parameters stayed within specification. The resulting boards demonstrate stable performance consistent with the documented processes.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
