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4 Layer HDI PCB Production Record #HDI-20260130-040

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 20 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 162 x 73 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish Immersion Silver Min Hole Size 0.15mm
Solder Mask Matte Green Silkscreen None

Manufacturing Timeline

Order Created
Jan 13 16:29
Files Ready
Jan 13 16:29
Engineering Review Completed
Jan 13 17:00
Payment down
Jan 15 07:51
Production Started
Jan 15 07:52
Production Completed
Jan 29 19:09
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 14.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.0d
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Jan 30 18:05

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electrical Testing

Manufacturing Summary

This 4-layer HDI board measured 162 × 73 mm with 1 oz copper on inner and outer layers and a 1.6 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 20 pieces as single boards, the design featured 4 mil line/space, 0.15 mm holes, blind vias, immersion silver surface finish, and countersink holes. The tighter geometry on a standard layer count required focused DFM attention to maintain yield and feature integrity.

 

DFM review confirmed the stackup for the target board thickness. Countersink holes positioned over copper features were processed as plated with verified depth calculations around 1.35 mm to achieve proper exposure. Drill tolerance concerns were noted for specific holes, while solder mask color and board thickness references were reconciled against production data. Core material options were evaluated to meet the specified thickness without extended lead times. Final files incorporated these adjustments after customer confirmation. countersink depth control ensured accurate milling without damaging surrounding copper or inner layers.

 

Production completed successfully within 13 days, with all boards passing 100% flying probe testing. The panels achieved consistent registration, plating, and surface quality despite the tight line/space and countersink requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260514-035 HDI PCB 4 210 x 100 Green OSP 10 View detail
HDI-20260512-016 HDI PCB 4 63.5 x 127 Green ENIG (Immersion Gold) 10 View detail
HDI-20260422-051 HDI PCB 4 210 x 100 Green OSP 10 View detail

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