| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 20 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 162 x 73 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | Immersion Silver | Min Hole Size | 0.15mm |
| Solder Mask | Matte Green | Silkscreen | None |
This 4-layer HDI board measured 162 × 73 mm with 1 oz copper on inner and outer layers and a 1.6 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 20 pieces as single boards, the design featured 4 mil line/space, 0.15 mm holes, blind vias, immersion silver surface finish, and countersink holes. The tighter geometry on a standard layer count required focused DFM attention to maintain yield and feature integrity.
DFM review confirmed the stackup for the target board thickness. Countersink holes positioned over copper features were processed as plated with verified depth calculations around 1.35 mm to achieve proper exposure. Drill tolerance concerns were noted for specific holes, while solder mask color and board thickness references were reconciled against production data. Core material options were evaluated to meet the specified thickness without extended lead times. Final files incorporated these adjustments after customer confirmation. countersink depth control ensured accurate milling without damaging surrounding copper or inner layers.
Production completed successfully within 13 days, with all boards passing 100% flying probe testing. The panels achieved consistent registration, plating, and surface quality despite the tight line/space and countersink requirements.
These boards deliver high routing density through laser-drilled microvias and sequential lamination while maintaining controlled production costs.
Senior PCB manufacturing engineer shares real factory insights on common engineering queries for multilayer HDI PCBs including 4 Layer HDI PCB, 6 Layer HDI PCB, 8 Layer HDI PCB, and 10 Layer HDI PCB. Learn about microvia stacking, registration challenges, impedance control, and practical DFM tips to reduce EQs and improve production yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260514-035 | HDI PCB | 4 | 210 x 100 | Green | OSP | 10 | View detail |
| HDI-20260512-016 | HDI PCB | 4 | 63.5 x 127 | Green | ENIG (Immersion Gold) | 10 | View detail |
| HDI-20260422-051 | HDI PCB | 4 | 210 x 100 | Green | OSP | 10 | View detail |