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8 Layer HDI PCB Production Record #HDI-20260410-032

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 375 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 22 x 32.5 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Feb 17 17:28
Files Ready
Feb 17 18:15
Engineering Review Completed
Feb 19 14:10
Payment down
Feb 25 02:07
Production Started
Feb 25 02:08
Production Completed
Apr 10 14:49
Progress: 0/6
Engineering Review time: 0.9 h Multiple File Revisions
Production time: 44.6d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.7 h
Carrier
SF Express
Destination
CHINA, PEOPLES REPUBLIC
Shipping Method
Express Air
Shipping Time
Apr 10 15:29

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This manufacturing record covers the production of 375 panels of an 8-layer HDI PCB, each measuring 22 × 32.5 mm and built to a thin 0.8 mm finished thickness with a custom stackup incorporating blind vias. The design called for 4/4 mil minimum trace and spacing on 1 oz copper layers, 0.15 mm minimum holes, green soldermask, and immersion gold ENIG surface finish. With no silkscreen specified, production focused on the multilayer lamination and via formation processes.

 

We conducted engineering review and material preparation before inner layer imaging and precise circuit etching. Particular care was taken during layer stack alignment and high-pressure lamination to ensure reliable registration for the blind vias within the thin 8-layer construction. Solder mask application, electroless nickel deposition, immersion gold deposition, batch AOI inspection, and final electrical testing verified performance across the full batch.

 

The 44.6-day production schedule accommodated the sequential build steps required by this custom thin-board configuration, resulting in consistent dimensional accuracy and electrical reliability in every delivered panel.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260530-027 HDI PCB 18 22 x 14 Green ENIG (Immersion Gold) 200 View detail
HDI-20260526-028 HDI PCB 10 80 x 80 Green ENIG (Immersion Gold) 250 View detail
HDI-20260512-016 HDI PCB 4 63.5 x 127 Green ENIG (Immersion Gold) 10 View detail

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